(China (Mainland))
Product Summary
The TLP185GB is a small outline coupler, suitable for surface mount assembly. The device consists of a photo transistor optically coupled to a gallium arsenide infrared emitting diode. Since the TLP185GB is smaller than DIP package, it is suitable for high-density surface mounting applications such as programmable controllers.
Parametrics
TLP185GB absolute maximum ratings: (1)Collector.emitter voltage VCEO: 80 V; (2)Emitter.collector voltage VECO: 7 V; (3)Collector current IC: 50 mA; (4)Collector power dissipation PC: 150 mW; (5)Collector power dissipation derating (Ta ≥ 25℃) △PC / ℃: -1.5 mW / ℃; (6)Junction temperature Tj: 125 ℃; (7)Operating temperature range Topr: -55 to 110 ℃; (8)Storage temperature range Tstg: -55 to 125 ℃; (9)Lead soldering temperature Tsol: 260 (10s) ℃; (10)Total package power dissipation PT: 200 mW; (11)Total package power dissipation derating (Ta ≥ 25℃) △PT / ℃: -2.0 mW / ℃; (12)Isolation voltage (AC, 1min., R.H. ≤ 60%) BVS: 3750 Vrms.
Features
TLP185GB features: (1)Collector-emitter voltage: 80V (min); (2)Current transfer ratio: 50% (min), Rank GB: 100% (min); (3)Isolation voltage: 3750Vrms (min); (4)Operation Temperature:-55 to 110 ℃; (5)Safety Standards, UL approved: UL1577, File No. E67349, cUL approved: CSA Component Acceptance Service No. 5A.
Diagrams
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