(China (Mainland))
Product Summary
The TLP181GB is a small outline coupler, suitable for surface mount assembly. It consists of a photo transistor, optically coupled to a gallium arsenide infrared emitting diode in a four lead plastic DIP package.
Parametrics
TLP181GB absolute maximum ratings: (1)forward current:50 mA;(2)forward current detating:-0.7 (Ta ≥ 53℃) mA/℃; (3)pulse forward current (100μs pulse, 100pps):1 A; (4)reverse voltage:5 V; (5)junction temperature:125 ℃; (6)collector-emitter voltage:80 V; (7)emitter-collector valtage:7 V; (8)collector current:50 mA; (9)collector power dissipation (1 circuit): 150 mW; (10)collector power dissipation derating (1 circuit Ta ≥ 25℃): -1.5 mW/℃; (11)junction temperature:125 ℃; (12)lead soldering temperature:260 (10s) ℃; (13)operating temperature range: -55 to 100 ℃; (14)storage temperature range: -55 to 125 ℃; (15)total package power dissipation: 200 mW; (16)isolation voltage (AC, 1min., R.H. ≤ 60%): 3750 Vrms; (17)total package power dissipation derating (Ta ≥ 25℃): -2.0 mW ℃.
Features
TLP181GB features: (1)collector-emitter voltage: 80V (min.);(2)current transfer ratio: 50% (min.) rank GB: 100% (min.);(3)isolation voltage: 3750V rms (min.);(4)UL recognized: UL1577, file no. E67349.
Diagrams
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 TLP181GB |
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