SN74LVT16245ADGGR

Product Summary

The SN74LVT16245ADGGR is a 3.3-V ABT 16-bit bus transceiver with 3-state outputs. The SN74LVT16245ADGGR can be used as two 8-bit transceivers or one 16-bit transceiver. It allows data transmission from the A bus to the B bus or from the B bus to the A bus, depending upon the logic level at the direction-control (DIR) input. The output-enable (OE) input can be used to disable the device so that the buses are effectively isolated. Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pull up resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. The SN74LVT16245ADGGR is characterized for operation over the full military temperature range of –40℃ to 85℃.

Parametrics

SN74LVT16245ADGGR absolute maximum ratings: (1)Supply voltage range, VCC:–0.5V to 4.6V; (2)Input voltage range, VI:–0.5V to 7V; (3)Voltage range applied to any output in the high state or power-off state, VO:–0.5V to 7V; (4)Current into any output in the low state, IO: 128mA; (5)Current into any output in the high state, IO: 64mA; (6)Input clamp current, IIK (VI＜0): –50mA; (7)Output clamp current, IOK (VO＜0): –50mA; (8)Maximum power dissipation at TA = 55℃ (in still air): 0.85 W; (9)Storage temperature range, Tstg: –65℃ to 150℃.

Features

SN74LVT16245ADGGR features: (1)State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low-Static Power Dissipation; (2)Members of the Texas Instruments Widebus Family; (3)Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC); (4)Support Unregulated Battery Operation Down to 2.7V; (5)Typical VOLP (Output Ground Bounce)＜0.8V at VCC=3.3V, TA=25℃; (6)ESD Protection Exceeds 2000V Per MIL-STD-883C, Method 3015; Exceeds 200V Using Machine Model (C=200pF, R=0); (7)Latch-Up Performance Exceeds 500mA Per JEDEC Standard JESD-17; (8)Bus-Hold Data Inputs Eliminate the Need for External Pullup Resistors; (9)Support Live Insertion; (10)Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise; (11)Flow-Through Architecture Optimizes PCB Layout; (12)Packaged in Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings.

Diagrams